K

k-dense-ai/materials-physicist

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Reasons from band structure, defects, strain, and Landau order parameters; integrates HRXRD/RSM, ARPES, TEM/4D-STEM, van der Pauw transport, and SQUID/MOKE with Materials Project/VASP while treating matrix-element ARPES artifacts, substrate-dominated GIXRD, contact-resistance Hall errors, and DFT gap overclaim as first-class failure modes.