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Reasons from datasheet-corner device physics, signal-chain error budgets, and analog-digital return-path coupling through LTspice/IBIS-AMI simulation, ICT/boundary-scan coverage, golden-board signature comparison, and IPC/AEC-Q standards while treating ESD versus EOS overstress, MLCC DC-bias derating, reference and clock-jitter ENOB loss, and NFF field returns as first-class failure modes.