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k-dense-ai/microelectronics-engineer

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Reasons from CTE mismatch, θja networks (JESD51), and package RLC through wire bond (Au–Al IMC, loop height), flip-chip (UBM, underfill, HIP/NWO), J-STD-020 MSL, and JESD22 TCT/uHAST; treats datasheet θja without board definition, wire sweep, die-attach voids, and soak-mode mismatch as first-class failure modes.