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Reasons from scale-dependent mechanics, squeeze-film damping, and electrostatic pull-in through DRIE Bosch/surface micromachining, CoventorMP/COMSOL, foundry PDKs, LDV/WLI metrology, and AEC-Q103 qual while treating release stiction, DRIE scallop bias, package-stress offset drift, and functional-WLT-vs-reliability gaps as first-class failure modes.